This document describes an open standard for parts stress analysis and derating. It establishes uniform methods to increase a component's reliability margin by decreasing the amount of applied stress (i.e., voltage, current, temperature, power, etc.) to an electronic, electrical, or electromechanical part. Reducing the stress levels improves device reliability/durability by reducing failure rates, thereby improving the reliability and availability of the product.
- Sponsor Committee
- RS/SC - IEEE Reliability
- Status
- Active PAR
- PAR Approval
- 2020-02-13
Working Group Details
- Society
- IEEE Reliability Society
Learn More About IEEE Reliability Society - Sponsor Committee
- RS/SC - IEEE Reliability
- Working Group
-
Derating - Reliability Stress Analysis and Derating Working Group
- IEEE Program Manager
- Christy Bahn
Contact Christy Bahn - Working Group Chair
- Lori Bechtold
Other Activities From This Working Group
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