This Guide provides manufacturers and users of printed-circuit-board-level shielding with appropriate methods for the characterization of the shielding effectiveness of the board-level shields. It also discusses the effect of various techniques to mount shields to printed-circuit boards and the effect on shielding effectiveness. This document guides the user in the selection of the appropriate test method to determine the level of shielding provided in the intended application.
- Sponsor Committee
- EMC/SDCom - Standards Development Committee
Learn More - Status
- Active PAR
- PAR Approval
- 2016-06-30
Working Group Details
- Society
- IEEE Electromagnetic Compatibility Society
Learn More - Sponsor Committee
- EMC/SDCom - Standards Development Committee
Learn More - Working Group
-
BLS - Working group for the characterization of the SE of board level shielding
Learn More - IEEE Program Manager
- Jennifer Santulli
Contact - Working Group Chair
- Davy Pissoort
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No Inactive-Withdrawn Standards
No Inactive-Reserved Standards