Inactive-Reserved Standard

IEEE 1156.2-1996

IEEE Standard for Environmental Specifications for Computer Systems

Reaffirmed 2003. This standard is designed for use in conjunction with other documents such as the IEEE 1101 group of standards, the IEEE 896 group of standards, the IEEE 1596 group of standards, the IEEE 1014 group of standards, and ISO/IEC 10861: 1994. This standard is one of the IEEE P1156.x series for environmental specifications. It is intended to be used as a core specification. It contains minimum environmental withstand conditions applicable to computer systems and all of their associated components. It has been created to provide general environmental withstand conditions for one or more of the above listed computer buses or interconnect standards, and electronic equipment in general.

Sponsor Committee
C/MSC - Microprocessor Standards Committee
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Status
Inactive-Reserved Standard
Board Approval
1996-06-20
History
ANSI Approved:
1997-06-05
Published:
1995-11-30
Inactivated Date:
2019-11-07

Working Group Details

Society
IEEE Computer Society
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Sponsor Committee
C/MSC - Microprocessor Standards Committee
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Working Group
1156_WG - Environmental Specifications Working Group
IEEE Program Manager
Tom Thompson
Contact
Working Group Chair
Ralph Kearfott
No Active Projects
No Active Standards
No Superseded Standards
No Inactive-Withdrawn Standards

1156.1-1993

IEEE Standard Microcomputer Environmental Specifications for Computer Modules

Fundamental information on minimum environmental withstand conditions is provided. The information is intended to be used in those cases in which a generic or detail specification for a certain module has been prepared. The intent is to achieve uniformity and reproducibility in the test conditions for all modules that may make up larger systems and are purported to have a rated environmental performance level. The specifications pertain to both the natural and artificial environments to which modules may be exposed. These conditions include, but are not limited to, thermal, mechanical, electrical, and atmospheric stresses.

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