Industry Connections (IC) 3D Body Processing

Industry Connections and Standards Group for 3D Body Processing (3DBP)

The motivations and goals of this program are to bring together diverse stakeholders from across technology, retail, research and standards development to build thought leadership around 3D body processing technology standards in areas such as 3D capture, processing, storage, sharing and (augmented) representation. Exploration of this activity may include:

  • Identify and classify types of 3D body processing technologies
  • Identify and classify use cases of 3D body processing
  • Identify gaps in existing nascent standards and recommended practices as 3D body processing spreads beyond first adopters
  • Identify need and propose PARs for new standards and best practices for 3D body processing and adjacent technologies (like 2D augmented reality)
  • Identify guides & recommendations for consuming or using body measurements, to better understand the benefits and limitations of this type of data

Please help the 3D Body Processing Industry Connections group understand the advantages and challenges with 3D Technology in the Retail industry by taking a short survey. The survey will be anonymous and should only take about 10 minutes of your time.

3DBP IC Groups and P3141

The work of the IC group moves over the standards group after research has been completed.

3DBP IC Groups

Quality Objectives

This subgroup plans to provide methods, tools, benchmarks, resources and testing procedures to define and quantify the quality of 3D models as well as the quality of the critical data for use cases, such as body landmarks and measurements or use applications such as VR.


This subgroup was formed to address how the different concerns of footwear can impact customer 3D scanning data. Footwear sizing concerns are as follows: footwear dimensions are impacted by the amount of weight on the foot; footwear is last based — either physical or digital; there is a lack of consensus as to what constitutes critical measurements for fit in footwear; and there is a lack of understanding of how mobility of the foot affects fit in footwear. Since footwear is last based, further research has expanded to include last definitions and measurements. Other research includes proposed new foot measurements and the impact of AI and foot scans on parametric footwear models.

Fit Subgroup

Technologies that have radicalized other industries have had limited effect and slow adoption within the apparel pipeline. Having identified “Fit” as key obstacle, this sub-group was formed. The goal is to determine what 3D related systems/processes need standards or new methodologies, beyond current industry practices/methodologies, for describing Apparel Fit in 3D and are relevant for 2D apparel manufacturing practices. The subgroup has begun by considering communication barriers regarding language, terminology, definitions and body shapes along with 3D scanning that may impact the methodology of 2D and 3D pattern making.

3DBP P3141 Groups (For IEEE Working Group Members)

Communication, Security, Privacy, and Trust (CSPT)

This subgroup is investigating the secure transmission and storage, as well as the use, protection and privacy of records that contain personal information as it pertains to 3D body processing. The IEEE 3DBP hopes to leverage existing global practices to examine adjacent projects that may provide insights into CSP procedures, establish and formalize processes to help ensure CSP methods, and develop minimum CSP practices to improve individual privacy and security, regardless of the communication protocol used in information or record exchange and storage. This subgroup is also analyzing how new technologies based on artificial intelligence (AI), cloud computing, Internet of Things, big data, 5G communications, and other technologies may impact the retail environment.


This subgroup plans to provide methods, tools, benchmarks, resources and testing procedures to define and quantify the quality of 3D models as well as the quality of the critical metadata for use cases, such as body landmarks and measurements. In addition, this sub-group plans to evaluate the requirements needed for materials such as textiles for quality of garment modeling.

3D Ecosystem

To understand the landscape of the 3D ecosystem, the P3141 will be determining different use cases and conducting 3D scanning technologies review along with recommendations for Metadata and File formats requirements

  • 3D scanning technologies
  • Use Cases
  • Metadata and File Format Requirements

Possible Industry Outcomes

Proposed deliverables and outcomes from this Industry Connections activity may include documents (e.g., white papers, reports), proposals for standards, conferences and workshops, databases, computer code, etc.

Potential Markets Include:

  • Fashion
  • Retail
  • Health/wellness
  • Athletics

Types of Suppliers:

  • User-facing/product offering Supplier
  • Platform Suppliers
  • Application Software Suppliers
  • Application Processor Suppliers
  • Operating System Suppliers

IEEE - 3DRC Collaboration

Many of retail and apparel industry members of our Industry Connections group are also engaged in the 3D Retail Coalition. IEEE 3DBP and the 3DRC are working together on complimentary activities that enhance the goals of each group.

The 3D Retail Coalition (3D.RC), is a collaborative group of global retailers and brands, working together to advance 3D technology for the apparel, accessories, and footwear designers, retailers, manufacturers and supply chains.

Collaboration is taking place for 3 work streams.


This sub-committee envisions standards that will accelerate new product development throughout the entire value chain and an ability for industry to adopt 3D platforms and ways of working with confidence.


This sub-committee envisions highly transferable material libraries, a standardized open materials data platform and efficient, high quality, cost effective testing methods.


This sub-committee envisions improved collaboration between educational institutions and solution developers; stronger and mutually beneficial partnerships between colleges/universities and brands/retailers; and educators and practitioners aligned on today’s 2D/3D skillsets and certification requirements.

Past 3D Virtualization Grand Challenge Winners

2023 Winners of the 3D Virtualization Grand Challenge

Winners – Apotheosis Group and University of British Columbia

In collaboration with Kalypso and IEEE, the 3D Retail Coalition (3DRC) hosted the sixth annual Grand Challenge in late 2023. Teams from around the world submitted projects focused on this year’s theme: the transformative potential of Generative AI for 3D Product Creation. With creative research and innovative solutions, teams aimed to show how their projects could revolutionize how retailers and brands discover, create, make, and sell new products.

Learn More About the 2023 Grand Challenge Winners

2022 Winners of the 3D Virtualization Grand Challenge

Winner – Emersya

Now in its fifth year, the 2022 3DRC Grand Challenge: 3D Virtualization for Retailers and Brands invited the academic and research communities to present creative research and solutions with the potential to transform how companies create, make, and sell new products by harnessing the power of digital product creation.

Learn More About the 2022 Grand Challenge Winner

2021 Winners of the 3D Virtualization Grand Challenge

Winners – Universidad Rey Juan Carlos, University of Florence, and Vital Mechanics Won the 2021 Retail Digital Transformation Grand Challenge

Now in its fourth year, this year the competition challenges the academic and research communities to offer up innovations, research and solutions to address these issues while helping build capabilities for the future of retail.

Learn More About the 2021 Grand Challenge Winners

2020 Winners of the 3D Virtualization Grand Challenge

Winner – unspun

The 2020 Retail Digital Transformation Grand Challenge announced unspun, a pioneering apparel brand that has reinvented the conventional apparel value chain, as the winner of the competition.

Learn More About the 2020 Grand Challenge Winner

2019 Winner of the Retail Digital Transformation Grand Challenge

Winner – 3DLOOK

Check out the 2019 winner and stay tuned here for information about the 2020 grand challenge that will be launching in February 2020.

Learn About the 2019 Challenge Winner

2018 Winner of the Retail Digital Transformation Grand Challenge

Winner – Shimmy Technologies

In 2018 IEEE 3DBP, the 3DRC and PI introduced the Retail Digital Transformation Grand Challenge. Check out the 2018 winner.

Learn About the 2018 Challenge

News & Events

Upcoming events of interest where 3DBP participants will be attending.


25-27 June 2024 | Marina Bay Sands, Singapore

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AHFE Conference

24-27 July 2024 | Nice, France

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28 July – 1 August 2024 | Denver, CO

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5-6 September 2024 | Dresden, Germany

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29th International Conference on 3D Web Technology

25-27 September 2024 | Guimarães, Portugal

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3D Body Tech

22-23 October 2024 | Lugano, CH

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21-25 October 2024 | Seattle, WA

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20-23 November 2024 | Long Beach, CA

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Download Complimentary White Papers

The background, goals, and status for the IEEE 3D body processing (3DBP) initiative are introduced in this white paper. This initiative was launched in the first quarter of 2016 with an initial focus on exploring technology standardization opportunities for hardware and software technologies across the 3D body processing pipeline; i.e., from scanning of people and creating body model data to simulating, modeling, analytics, and visualization.








Get Involved

Additional Contacts

IEEE SA IC 3D Body Processing Leadership

Carol McDonald, Chair, Gneiss Concept

3DBP IC Subgroups

Quality Objectives

Alfredo Ballester Fernández, Instituto de Biomecánica (IBV)


Carol McDonald, Gneiss Concept


Carol McDonald (temporary), Gneiss Concept

P3141 Subgroups


Paul Reioux, Prism Labs

Communication, Security, Privacy and Trust

Randy Rannow, Silverdraft Supercomputing and Catherine Jai, Texas Tech University

Use Cases

William Glascoe, H-Anim WG Co-Chair, Web3D Consortium

3D Scanning Technologies

Loretta Reiss, Independent

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