Industry Connections (IC) 3D Body Processing

3DBP IC GROUPS

• Communication, Security, and Privacy (CSP)
  This subgroup is investigating the secure transmission and storage, as well as the use, protection and privacy of records that contain personal information as it pertains to 3D body processing. The IEEE 3DBP hopes to leverage existing global practices to examine adjacent projects that may provide insights into CSP procedures, establish and formalize processes to help ensure CSP methods, and develop minimum CSP practices to improve individual privacy and security, regardless of the communication protocol used in information or record exchange and storage.
• Quality
  This sub-group plans to provide methods, tools, benchmarks, resources and testing procedures to define and quantify the quality of 3D models, as well as the quality of the critical metadata for use cases, such as body landmarks and measurements.
  
• Footwear
  This subgroup was formed to address how the different concerns of footwear can impact customer 3D scanning data. Footwear sizing concerns are as follows: footwear dimensions are impacted by the amount of weight on the foot; footwear is last based – either physical or digital; there is a lack of consensus as to what constitutes critical measurements for fit in footwear; and there is a lack of understanding of how mobility of the foot affects fit in footwear.

• File Formats/Metadata
  This working group intends to recommend existing file formats that support the linkage and management of 3D data and all its all related metadata. This subgroup also intends to define mandatory and optional metadata derived from 3D processing, the access of which is valuable for industry applications.
• Fit Subgroup
  Technologies that have radicalized other industries have had limited effect and slow adoption within the apparel pipeline. Having identified “Fit” as key obstacle, this sub-group was formed. The goal is to determine what 3D related systems/processes need standards or new methodologies beyond current industry practices/methodologies for describing Apparel Fit in 3D and relevant for 2D apparel manufacturing practices.  The subgroup will begin by considering communication barriers regarding language, terminology, and definitions and then investigate how 3D scanning may impact the methodology of 2D and 3D pattern making.

• Mega Technologies
  The Mega Technology Trends subgroup plans to analyze how new technologies based on artificial intelligence (AI), cloud computing, Internet of Things, big data, 5G communications, and other technologies may impact the retail environment.