Industry Connections (IC) 3D Body Processing

Giving consumers a deeper sense for how garments will fit their individual body and personal sense of style through realistic and interactive visual representations

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2020 Retail DT Grand Challenge

Now in its third year, this competition challenges the technology and academic community to offer up innovations and solutions to address these issues while helping build capabilities for the future of retail.



  • Communication, Security, and Privacy (CSP)
    This subgroup is investigating the secure transmission and storage, as well as the use, protection and privacy of records that contain personal information as it pertains to 3D body processing. The IEEE 3DBP hopes to leverage existing global practices to examine adjacent projects that may provide insights into CSP procedures, establish and formalize processes to help ensure CSP methods, and develop minimum CSP practices to improve individual privacy and security, regardless of the communication protocol used in information or record exchange and storage.
  • Quality
    This sub-group plans to provide methods, tools, benchmarks, resources and testing procedures to define and quantify the quality of 3D models, as well as the quality of the critical metadata for use cases, such as body landmarks and measurements.
  • Footwear
    This subgroup was formed to address how the different concerns of footwear can impact customer 3D scanning data. Footwear sizing concerns are as follows: footwear dimensions are impacted by the amount of weight on the foot; footwear is last based – either physical or digital; there is a lack of consensus as to what constitutes critical measurements for fit in footwear; and there is a lack of understanding of how mobility of the foot affects fit in footwear.


  • File Formats/Metadata
    This working group intends to recommend existing file formats that support the linkage and management of 3D data and all its all related metadata. This subgroup also intends to define mandatory and optional metadata derived from 3D processing, the access of which is valuable for industry applications.
  • Fit Subgroup
    Technologies that have radicalized other industries have had limited effect and slow adoption within the apparel pipeline. Having identified “Fit” as key obstacle, this sub-group was formed. The goal is to determine what 3D related systems/processes need standards or new methodologies beyond current industry practices/methodologies for describing Apparel Fit in 3D and relevant for 2D apparel manufacturing practices.  The subgroup will begin by considering communication barriers regarding language, terminology, and definitions and then investigate how 3D scanning may impact the methodology of 2D and 3D pattern making.
  • Mega Technologies
    The Mega Technology Trends subgroup plans to analyze how new technologies based on artificial intelligence (AI), cloud computing, Internet of Things, big data, 5G communications, and other technologies may impact the retail environment.    


Proposed deliverables and outcomes from this Industry Connections activity may include documents (e.g., white papers, reports), proposals for standards, conferences and workshops, databases, computer code, etc.

Potential Markets Include:

  • Fashion
  • Retail
  • Health/wellness
  • Athletics

Types of Suppliers:

  • User-facing/product offering Supplier
  • Platform Suppliers
  • Application Software Suppliers
  • Application Processor Suppliers
  • Operating System Suppliers


Many of retail and apparel industry members of our Industry Connections group are also engaged in the 3D Retail Coalition. IEEE 3DBP and the 3DRC are working together on complimentary activities that enhance the goals of each group.

The 3D Retail Coalition (3D.RC), is a collaborative group of global retailers and brands, working together to advance 3D technology for the apparel, accessories, and footwear designers, retailers, manufacturers and supply chains.

Collaboration is taking place for 3 work streams.

  • Technology
    This sub-committee envisions standards that will accelerate new product development throughout the entire value chain and an ability for industry to adopt 3D platforms and ways of working with confidence.
  • Innovation
    This sub-committee envisions highly transferable material libraries, a standardized open materials data platform and efficient, high quality, cost effective testing methods.
  • Education
    This sub-committee envisions improved collaboration between educational institutions and solution developers; stronger and mutually beneficial partnerships between colleges/universities and brands/retailers; and educators and practitioners aligned on today’s 2D/3D skillsets and certification requirements.

Learn more about 3DRC Collaboration

Grand Challenge Winners

2019 winner of the Retail Digital Transformation Grand Challenge

Winner - 3DLOOK

Check out the 2019 winner and stay tuned here for information about the 2020 grand challenge that will be launching in February 2020.

Learn about the 2019 challenge winner



2018 winner of the Retail Digital Transformation Grand Challenge

Winner - Shimmy Technologies

In 2018 IEEE 3DBP, the 3DRC and PI introduced the Retail Digital Transformation Grand Challenge. Check out the 2018 winner.

Learn about the 2018 challenge

Upcoming events of interest where 3DBP participants will be attending


2020 Retail DT Grand Challenge
Web3D 2020
Virtual Conference
9-13 November 2020
3D generated humans image
3DBODY.TECH Conference & Expo
17-18 November 2020


The background, goals, and status for the IEEE 3D body processing (3DBP) initiative are introduced in this white paper. This initiative was launched in the first quarter of 2016 with an initial focus on exploring technology standardization opportunities for hardware and software technologies across the 3D body processing pipeline; i.e., from scanning of people and creating body model data to simulating, modeling, analytics, and visualization.


We welcome new participants that are interested in 3D body processing quality; file formats and metadata; footwear impact; communication, security and privacy; and mega technology trends in apparel and footwear.


Additional Contacts

Industry Connections Program Administrator

IEEE SA IC 3D Body Processing Leadership
Carol McDonald, Chair, Gneiss Concept
Alfredo Ballester Fernandez, Vice Chair

Quality – Carol McDonald, Gneiss Concept
Footwear – Carol McDonald, Gneiss Concept
File Formats and Metadata – Maxim Fedyukov, Texel
Communication, Security and Privacy - Randy Rannow, Silverdraft Supercomputing
Mega Technology Trends - Randy Rannow, Silverdraft Supercomputing
Fit - Dinesh Pai, Vital Mechanics, University of British Columbia

Other Organizations collaborating with 3DBP