IEEE-SA – Industry Connections (IC)                  3D Body Processing
Giving consumers a deeper sense for how garments will fit their individual body and personal sense of style through realistic and interactive visual representations

3DBP IC Groups            3DRC Collaboration            Events            White Papers            Get Involved            Resources

 

Meet the winner of the Retail Digital Transformation Grand Challenge

Winner - Shimmy Technologies

Shimmy Technologies solution the Shimmy Upskill application, is a gamified learning environment that upskills garment workers in areas such as computer literacy, digital pattern-making, and 3D modeling fundamentals so they can stay relevant as sewing automation becomes more prevalent in garment factories. Learn about the challenge.

3DBP IC GROUPS

  • Quality
    This sub-group plans to provide methods, tools, benchmarks, resources and testing procedures to define and quantify the quality of 3D models, as well as the quality of the critical metadata for use cases, such as body landmarks and measurements.
  • Footwear
    This subgroup was formed to address how the different concerns of footwear can impact customer 3D scanning data. Footwear sizing concerns are as follows: footwear dimensions are impacted by the amount of weight on the foot; footwear is last based – either physical or digital; there is a lack of consensus as to what constitutes critical measurements for fit in footwear; and there is lack of understanding of how compression of soft tissue affects fit in footwear.
  • File Formats/Metadata
    This working group intends to recommend existing file formats (or to create new ones if needed) that support the linkage and management of 3D data and all its all related metadata. This subgroup also intends to define mandatory and optional metadata derived from 3D processing, the access of which is valuable for industry applications.

 

  •  Communication, Security, and Privacy (CSP)
    This subgroup is investigating the secure transmission and storage, as well as the use, protection and privacy of records that contain personal information as it pertains to 3D body processing. The IEEE 3DBP hopes to leverage existing global practices to examine adjacent projects that may provide insights into CSP procedures, establish and formalize processes to help ensure CSP methods, and develop minimum CSP practices to improve individual privacy and security, regardless of the communication protocol used in information or record exchange and storage.
  • Mega Technologies
    The Mega Technology Trends subgroup plans to analyze how new technologies based on artificial intelligence (AI), cloud computing, Internet of Things, big data, 5G communications, and other technologies may impact the retail environment.    

POSSIBLE INDUSTRY OUTCOMES 

Proposed deliverables and outcomes from this Industry Connections activity may include documents (e.g., white papers, reports), proposals for standards, conferences and workshops, databases, computer code, etc.
 

Potential Markets Include:

  • Fashion
  • Retail
  • Health/wellness
  • Athletics

Types of Suppliers:

  • User-facing/product offering Supplier
  • Platform Suppliers
  • Application Software Suppliers
  • Application Processor Suppliers
  • Operating System Suppliers

IEEE - 3DRC COLLABORATION

Many of retail and apparel industry members of our Industry Connections group are also engaged in the 3D Retail Coalition. IEEE 3DBP and RC are working together on complimentary activities that enhance the goals of each group.

The 3D Retail Coalition (3D.RC), is a collaborative group of global retailers and brands, working together to advance 3D technology for the apparel, accessories, and footwear designers, retailers, manufacturers and supply chains.

Collaboration is taking place for 3 work streams.

  • Technology
    This sub-committee envisions standards that will accelerate new product development throughout the entire value chain and an ability for industry to adopt 3D platforms and ways of working with confidence.
  • Innovation
    This sub-committee envisions highly transferable material libraries, a standardized open materials data platform and efficient, high quality, cost effective testing methods.
  • Education
    This sub-committee envisions improved collaboration between educational institutions and solution developers; stronger and mutually beneficial partnerships between colleges/universities and brands/retailers; and educators and practitioners aligned on today’s 2D/3D skillsets and certification requirements.
     

Learn more about 3DRC Collaboration

NEWS & EVENTS
 
PI-NYC
New York, NY
June 2019
3DBODY.TECH Conference & Expo
Lugano, Switzerland
22-23 October 2019


DOWNLOAD COMPLIMENTARY WHITE PAPERS

The background, goals, and status for the IEEE 3D body processing (3DBP) initiative are introduced in this white paper. This initiative was launched in the first quarter of 2016 with an initial focus on exploring technology standardization opportunities for hardware and software technologies across the 3D body processing pipeline; i.e., from scanning of people and creating body model data to simulating, modeling, analytics, and visualization.

GET INVOLVED

We welcome new participants that are interested in 3D body processing quality; file formats and metadata; footwear impact; communication, security and privacy; and mega technology trends in apparel and footwear.

 

Additional Contacts

Industry Connections Program Administrator

IEEE-SA IC 3D Body Processing Leadership
Carol McDonald, Co-Chair, Gneiss Concept
Luciano C. Oviedo, Co-Chair

Subgroups
Quality – Carol McDonald, Gneiss Concept
Footwear – Carol McDonald, Gneiss Concept
File Formats and Metadata – Maxim Fedyukov, Texel
Communication, Security and Privacy - Randy Rannow, Silverdraft Supercomputing
Mega Technology Trends - Randy Rannow, Silverdraft Supercomputing