This standard defines a modular hierarchical language syntax, rules, and usage model to represent a high-level description of the components and connectivity between various components (including chiplets, interposers, substrates, etc.) in 2.5D/3D advanced packaging technologies. This description language enhances the 3Dblox description language. For each component, a high-level description includes size, orientation, interface, thickness, interconnect regions, interconnect structures, and other physical properties required for integration in a 2.5D/3D stack. The features of this description language are designed to serve chiplet makers, 2.5D/3D packagers, and end users.
- Standard Committee
- C/DA - Design Automation
- Status
- Active PAR
- PAR Approval
- 2024-12-11
Working Group Details
- Society
- IEEE Computer Society
- Standard Committee
- C/DA - Design Automation
- Working Group
-
3Dblox - 3Dblox-- Chiplet Connectivity and Physical Properties Description Language
- IEEE Program Manager
- Vanessa Lalitte
Contact Vanessa Lalitte - Working Group Chair
- Sandeep Goel
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