Standard Details
Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.
Sponsor Committee | |
Status |
Active
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Board Approval |
1992-12-03
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History |
Published Date:1992-11-30
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Additional Resources Details
PAR |
Approved PAR
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Working Group Details
Working Group |
1301_WG - 1301 Working Group
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Working Group Chair |
Ralph Kearfott
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Sponsor Committee | |
Society | |
IEEE Program Manager | |
Existing Standards |
1301-1991 - IEEE Standard for a Metric Equipment Practice for Microcomputers - Coordination Document
Administratively withdrawn January 2007 The metric mechanical coordination of microcomputer components, including the cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm is addressed. This generic standard may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. This choice of coordination dimensions for the mechanical structure for heights, widths, and depths lies within a homogeneous, metric, modular, three-dimensional grid as specified in IEC 917. The intent is to provide a single metric equipment practice for worldwide use.
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1301.1-1991 Metric Equipment Practice for Microcomputers - Convention-Cooled 2 mm Conn (PDF)
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Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.
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This standard establishes the metric modular order and coordination dimensions for mezzanine cards for use on host modules.
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