IEEE HomeSearch IEEE ShopWeb Account Contact IEEE IEEE
MembershipPublicationsServicesStandardsConferencesCareers/Jobs
IEEE-SA IEEE-SA Member Area Search our standards database for Abstract, Sponsor, Status, Contact,Ordering and Historical information. IEEE-SA Standards Association
Products & ServicesIEEE-SA MembershipStandards DevelopmentNews & InformationnavFillerHOMEHOME Icon

IEEE Std 1301.3-1992 IEEE Standard for a Metric Equipment Practice for Microcomputers—Convection-Cooled With 2.5 mm Connectors -Description

Abstract: Dimension requirements are presented for subracks, plug-in units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-1991 and with a 2.5 mm connector as defined in IEC 48B (Central Office) 245. The general arrangement, dimensions, and environmental requirements are covered. This standard may be used with other IEEE Std 1301 .x connector implementations in the subrack.

Keywords: backplane, cabinets, connector, interchangeability, metric, microcomputer component dimensions, plug-in unit, printed board, rack, subrack

Content +

  • 1. Overview
    • 1.1 Scope
    • 1.2 Purpose
    • 1.3 Dimensions
    • 1.4 Coordination dimensions
    • 1.5 Environmental requirements
    • 1.6 Conformance with this standard
  • 2. References
  • 3. Word usage, definitions, and abbreviations
    • 3.1 Special word usage
      • 3.1.1 may
      • 3.1.2 shall
      • 3.1.3 should
    • 3.2 Definitions
    • 3.3 Abbreviations
  • 4. Dimensional nomenclature
    • 4.1 Dimensional location nomenclature
    • 4.2 Dimensional nomenclature, heights
    • 4.3 Dimensional nomenclature, widths
    • 4.4 Dimensional nomenclature, depths
    • 4.5 Dimensional nomenclature, mounting pitches
  • 5. General arrangement
  • 6. Subracks
  • 7. Backplane design and mounting positions
    • 7.1 Rigidity
    • 7.2 Dimension
  • 8. Plug-in units
  • Annex A Tolerances with 2.5 mm connector and IEEE 1301 metric equipment
    • A.1 Scope
    • A.2 Definition/explanation of terms and parameters
    • A.3 Relationship between parameters
      • A.3.1 Gap
      • A.3.2 Allowance
    • A.4 Plug-in unit tilt
      • A.4.1 Cases to be considered when estimating tilt
      • A.4.2 Assumptions
      • A.4.3 Effect on pin wipe
      • A.4.4 Effect on sequencing
      • A.4.5 Recommendations

links: [Standard Status] - [Purchase] - [PDF*] - [Bus Architecture Collection - Description]

available for Standards Online Bus Architecture Collection subscribers only

spacer

Copyright ©2004 IEEE-SA
Contact IEEE-SA
(m.v.rodriguez@ieee.org)
URL: http://standards.ieee.org/reading/ieee/std_public/description/busarch/1301.3-1992_desc.html

spacer