IEEE Std 1301.2-1993 IEEE Recommended Practices for the Implementation of a Metric Equipment Practice (IEEE Std 1301-1991) -Description

Abstract: Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.

Keywords: backplane, cabinet, interchangeability, metric, microcomputer component dimensions, plug-in unit, printed board, rack, subrack

Content

• 1. Overview
• • 1.1 Scope and purpose
  • 1.2 Background
  • 1.3 Implementation
  • 1.4 Dimensions
  • 1.5 Coordination dimensions
  • • 1.5.1 Dimensions of cabinets and racks
    • 1.5.2 Dimensions of subracks and front panels
    • 1.5.3 Dimensions of plug-in units and printed boards
    • 1.5.4 Standardized dimensions
  • 1.6 Connector-related parameters
  • 1.7 Environmental requirements
• 2. References
• 3. Special word usage, definitions, and abbreviations
• • 3.1 Special word usage
  • 3.2 Definitions
  • 3.3 Abbreviations
• 4. Dimensional nomenclature
• 5. Interoperability
• • 5.1 Overall cabinet and rack sizes
  • 5.2 Mounting an IEC 297-3 (or IEEE 1101.1) subrack, rack, or cabinet panel in an IEEE 1301 cabinet or rack, and the reverse
  • • 5.2.1 Mounting hole pitch (width)
    • 5.2.2 Mounting hole pitch (height)
    • 5.2.3 Mounting IEC 297 subracks into IEEE 1301 cabinets or racks
    • 5.2.4 Mounting IEEE 1301 subracks into IEC 297 cabinets or racks
    • 5.2.5 Mounting holes
  • 5.3 Subracks
  • • 5.3.1 Subrack Height
    • 5.3.2 Subrack Aperture Height
    • 5.3.3 Subrack Guidance height
    • 5.3.4 Subrack width dimensions
  • 5.4 Plug-in units
  • • 5.4.1 Printed board height (also, guidance height for box or frame type plug-in units)
    • 5.4.2 Printed board thickness
    • 5.4.3 Printed board depth
    • 5.4.4 Plug-in unit and printed board reference plane
• 6. Cabinets and racks
• • 6.1 Cabinet or rack
  • • 6.1.1 Width—W_c (SU)
    • 6.1.2 Height—H_C (SU)
    • 6.1.3 Overall depth—D_C (SU)
    • 6.1.4 Type of cabinet or rack
    • 6.1.5 Base
    • 6.1.6 Top cover
    • 6.1.7 Moving or lifting aids
    • 6.1.8 Control elements, handles, hinges, etc.
  • 6.2 Rack and cabinet front panels
  • • 6.2.1 Height—H_2C (SU)
    • 6.2.2 Width—W₆
• 7. Subracks
• • 7.1 Subrack size selection
  • • 7.1.1 Height
    • 7.1.2 Width
    • 7.1.3 Depth
  • 7.2 Printed board guide
  • • 7.2.1 Plug-in unit guidance depth
  • 7.3 Front panel
  • 7.4 Thermal management considerations
• 8. Backplane
• • 8.1 Height
  • 8.2 Width
  • 8.3 Thickness
  • 8.4 Bow allowance
  • 8.5 Stiffeners
  • 8.6 Plug-in unit size or pitch
  • 8.7 Power distribution requirements
  • 8.8 Backplane connector requirements
• 9. Plug-in unit
• • 9.1 Plug-in unit requirements
  • • 9.1.1 Type
    • 9.1.2 Height—H_2C (SU)
    • 9.1.3 Width
    • 9.1.4 Depth—D₅
  • 9.2 Printed board
  • • 9.2.1 Size
    • 9.2.2 ESD features
  • 9.3 Front panel attachment option
  • 9.4 Indicators and switches
  • 9.5 Alignment pin
• 10. Connector requirements
• • 10.1 Connector type/pin pitch
  • 10.2 Backplane connectors
  • 10.3 Plug-in unit connectors (used only with box- or frame-type plug-in units)
  • 10.4 Printed board connectors
  • 10.5 Front mounted l/O connectors
• 11. Specific example
• • 11.1 Overview
  • 11.2 Profile B market segment
  • 11.3 Equipment practice
  • 11.4 Plug-in unit size considerations
  • 11.5 Plug-in unit pitch and I/O direction
  • 11.6 Plug-in unit printed board thickness
  • 11.7 Allowance for components on side 2 of the printed board
  • 11.8 Plug-in unit ESD protection
  • 11.9 Plug-in unit guide groove width definition
  • 11.10 Front panel and VDE/FCC considerations
  • 11.11 Backplane to plug-in unit connector choice
  • • 11.11.1 Bandwidth/signal integrity
    • 11.11.2 Power requirements
    • 11.11.3 Pin density
    • 11.11.4 Pin wipe
    • 11.11.5 Self-alignment
    • 11.11.6 Modularity of connector
    • 11.11.7 Pin sequencing
    • 11.11.8 Reliability
    • 11.11.9 Additional connector considerations
  • 11.12 Tolerance and alignment requirements
  • 11.13 Thermal considerations
  • 11.14 Safety considerations

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