IEEE Std 1156.4-1997 IEEE Standard for Environmental Specifications for Spaceborne Computer Modules -Description

Abstract: Fundamental information on minimum environmental withstand conditions for space electronics is provided. The intent is to achieve uniformity and reproducibility in the test conditions for all spaceborne computer modules that may make up larger systems and are purported to have a rated environmental performance level. The specifications pertain to both the natural and artificial environments to which spaceborne computer modules may be exposed. These conditions include, but are not limited to, thermal, mechanical, electrical, and radiation stresses.

Keywords: spaceborne computers, spaceborne modules, spaceborne systems

Content

• 1. Overview
• • 1.1 Background
  • 1.2 Scope
  • 1.3 Purpose
• 2. References
• 3. Definitions
• • 3.1 Special word usage
  • 3.2 Other definitions
• 4. Parameters and performance
• • 4.1 Parameter categories
  • • 4.1.1 Thermal
    • 4.1.2 Pressure and humidity
    • 4.1.3 Mechanical
    • 4.1.4 Radiation
  • 4.2 Performance levels
  • • 4.2.1 Performance Level I
    • 4.2.2 Performance Level II
    • 4.2.3 Performance Level III
    • 4.2.4 Performance Level IV (natural space radiation only)
    • 4.2.5 Performance Level IVa (radiation only)
  • 4.3 Performance level examples
• 5. Test approach
• • 5.1 Performance level qualification
  • 5.2 Test duration
  • 5.3 Initial and final measurements
  • 5.4 Qualification testing
  • 5.5 Acceptance testing
• 6. Test requirements
• • 6.1 Nonoperating conditions
  • • 6.1.1 Temperature
    • 6.1.2 Pressure
    • 6.1.3 Relative humidity
    • 6.1.4 Radiation
  • 6.2 Operating conditions
  • • 6.2.1 Temperature
    • 6.2.2 Pressure
    • 6.2.3 Relative humidity
    • 6.2.4 Pyrotechnic shock
    • 6.2.5 Random vibration
    • 6.2.6 Radiation environments
    • 6.2.7 Electromagnetic compatibility (EMC)
• 7. Test procedures
• • 7.1 Qualification test procedures
  • • 7.1.1 Functional
    • 7.1.2 Pyro shock
    • 7.1.3 Random vibration
    • 7.1.4 Thermal cycling
    • 7.1.5 Thermal vacuum
    • 7.1.6 Humidity
    • 7.1.7 Electromagnetic compatibility
    • 7.1.8 Radiation
  • 7.2 Acceptance test procedures
  • • 7.2.1 Functional
    • 7.2.2 Random vibration
    • 7.2.3 Thermal cycling
    • 7.2.4 Thermal vacuum
    • 7.2.5 Burn-in
• Annex A Radiation environments
• Annex B Nuclear weapons effects
• Annex C Radiation effects on microelectronics
• Annex D Radiation hardness assurance
• Annex E Bibliography

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