IEEE Std 1156.2-1996 IEEE Standard for Environmental Specifications for Computer Systems -Description

Abstract: This standard is designed for use in conjunction with other documents such as the IEEE 1101 group of standards, the IEEE 896 group of standards, the IEEE 1596 group of standards, the IEEE 1014 group of standards, and ISO/IEC 10861: 1994. This standard is one of the IEEE P1156.x series for environmental specifications. It is intended to be used as a core specification. It contains minimum environmental withstand conditions applicable to computer systems and all of their associated components. It has been created to provide general environmental withstand conditions for one or more of the above listed computer busses or interconnect standards, and electronic equipment in general.

Keywords: atmospheric stress, computer systems, conducted immunity, corrosion, drop heights, earthquake protection, electrical stress, electromagnetic induction (EMI), electrostatic discharge (ESD), environmental specifications, environmental testing, environmental withstand, fire resistance, flammability, humidity, mechanical stress, performance level qualification, shock, sinusoidal vibration, thermal shock, thermal testing, vibration

Content

• 1. Overview
• • 1.1 Scope
  • 1.2 Purpose
• 2. References
• 3. Terminology
• 4. Performance level qualification
• 5. Common testing conditions
• • 5.1 Normal operation
  • 5.2 Maximum power
  • 5.3 Mounting
  • 5.4 Test duration
  • 5.5 Initial and final measurements
• 6. Nonoperating environmental core conditions
• • 6.1 Low temperature (nonoperating/storage)
  • 6.2 High temperature (nonoperating/storage)
  • 6.3 Thermal shock (nonoperating/storage)
  • 6.4 Humidity (nonoperating/storage)
  • 6.5 Free fall (nonoperating/storage)
  • • 6.5.1 Packaged equipment
    • 6.5.2 Unpackaged equipment
  • 6.6 Vibration (nonoperating/storage)
  • 6.7 Shock (nonoperating/storage)
  • 6.8 Mixed flowing gas corrosion (nonoperating/storage)
  • 6.9 Fungus (nonoperating/storage)
  • 6.10 Flammability (nonoperating/storage)
  • • 6.10.1 General
    • 6.10.2 Fire resistance, PL1
    • 6.10.3 Fire resistance, PL2
  • 6.11 Electrostatic discharge (ESD) (nonoperating/storage)
• 7. Operating environmental conditions
• • 7.1 Low temperature (operating)
  • 7.2 High temperature (operating)
  • 7.3 Sinusoidal vibration (operating)
  • 7.4 Shock (operating)
  • 7.5 Low air pressure (operating)
  • 7.6 Electrostatic discharge (ESD) (operating)
  • 7.7 Electromagnetic induction (EMI) (operating)
  • • 7.7.1 FCC compliance
    • 7.7.2 Conducted immunity-dc ports
    • 7.7.3 Conducted immunity-ac power ports
    • 7.7.4 I/0 port immunity
  • 7.8 Earthquake protection
• Annex A Thermal testing of forced convection-cooled modules
• Annex B Shock and vibration fixtures

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