IEEE Std 1156.1-1993 IEEE Standard Microcomputer Environmental Specifications for Computer Modules -Description

Abstract: Fundamental information on minimum environmental withstand conditions is provided. The information is intended to be used in those cases in which a generic or detail specification for a certain module has been prepared. The intent is to achieve uniformity and reproducibility in the test conditions for all modules that may make up larger systems and are purported to have a rated environmental performance level. The specifications pertain to both the natural and artificial environments to which modules may be exposed. These conditions include, but are not limited to, thermal, mechanical, electrical, and atmospheric stresses.

Keywords: environmental withstand conditions, performance level qualification

Content

• 1. Overview
• 2. Scope
• 3. Purpose
• 4. References
• 5. Terminology
• • 5.1 Performance level
  • • 5.1.1 Performance Level 1:
    • 5.1.2 Performance Level 2:
    • 5.1.3 Performance Level 3:
    • 5.1.4 Performance Level 4:
    • 5.1.5 Performance Level 5:
  • 5.2 Sheltered applications
  • 5.3 Performance level qualification
  • 5.4 Normal operation
  • 5.5 Module
  • 5.6 Component
  • 5.7 Maximum power
  • 5.8 Mounting
  • 5.9 Test duration
  • 5.10 Initial and final measurements
  • 5.11 Relevant specification
• 6. Nonoperating environmental conditions
• • 6.1 Low temperature (nonoperating/storage)
  • 6.2 High temperature (nonoperating/storage)
  • 6.3 Thermal Shock (nonoperating/storage)
  • 6.4 Humidity (nonoperating/storage)
  • 6.5 Shock (nonoperating/storage)
  • 6.6 Salt fog corrosion (nonoperating/storage)
  • 6.7 Mixed flowing gas corrosion (nonoperating/storage)
  • 6.8 Fungus (nonoperating/storage)
  • 6.9 Flammability
  • • 6.9.1 Tests
    • 6.9.2 Compliance
  • 6.10 Electrostatic discharge (ESD) (nonoperating/storage)
• 7. Operating environmental conditions
• • 7.1 Low temperature (operating)
  • 7.2 High Temperature (operating)
  • 7.3 Sinusoidal vibration (operating)
  • 7.4 Random vibration (operating)
  • 7.5 Shock (operating)
  • 7.6 Low air pressure (operating)
  • 7.7 Electrostatic discharge (ESD) (operating)
  • 7.8 Electromagnetic interference (EMI) (operating)
  • 7.9 Life test (operating)
• 8. Test sequence
• • 8.1 Testing after failure
  • 8.2 Module changes
  • 8.3 Test groups
  • • 8.3.1 Nonoperating
    • 8.3.2 Operating
• Annex A Shock and vibration fixtures
• • A.1 Performance Levels 1, 2, and 3
  • • A.1.1 Scope
    • A.1.2 Fixture attributes
    • A.1.3 Fixture verification
  • A.2 Performance Levels 4 and 5
• Annex B Thermal testing of forced convection-cooled modules
• • B.1 Verification of a module's thermal design
  • B.2 Test slot requirements
  • B.3 Control of the variables and test performance
  • • B.3.1 Operation of the unit under test
    • B.3.2 Power dissipation in adjacent slots
    • B.3.3 Input air velocity, uniformity, and back pressure
    • B.3.4 Input air temperature
    • B.3.5 Testing
    • B.3.6 Guidance

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