IEEE Std 1101.7-1995 IEEE Standard for Space Applications Module, Extended Height Format E Form Factor -Description

Abstract: The design requirements for a module designated for use in spacecraft, boosters, and other highly rugged, conductively cooled environments are established in this standard. The requirements herein serve to specify the mechanical design of the module. Dimensions and tolerances for racks, modules, printed wiring boards, backplanes, and other connector-related dimensions that are specific to the use of 300-pin and 396-pin connectors are given. These dimensions and tolerances are designed to ensure mechanical function and interoperability.

Keywords: mechanical interchangeability, module, SEM Format E extended height, space applications

Content

• 1. Overview
• • 1.1 Scope
  • 1.2 Purpose
  • 1.3 Mechanical characteristics
  • 1.4 Environmental requirements
• 2. References
• 3. Definitions
• • 3.1 Special word usage
  • 3.2 Technical definitions
• 4. Module requirements
• • 4.1 Module description
  • 4.2 Module construction
  • 4.3 Clearances
  • 4.4 Module identification
  • 4.5 Thermal requirements
  • 4.6 Reliability
  • 4.7 Module warp
  • 4.8 Mechanical bonding
  • 4.9 Personnel safety
  • 4.10 Test points
  • • 4.10.1 Acceptance testing
  • 4.11 EMI considerations
  • 4.12 Printed circuit design
  • 4.13 Materials
  • • 4.13.1 Toxic materials
    • 4.13.2 Flammable material
    • 4.13.3 Material affected by fungi
    • 4.13.4 Adhesive-backed labels
    • 4.13.5 Hazardous components and materials
    • 4.13.6 Material outgassing
  • 4.14 Finishes and protective treatments
  • • 4.14.1 Module surface finish
    • 4.14.2 Copper and copper composite frame plating
    • 4.14.3 Aluminum frame plating
    • 4.14.4 Connector body plating
    • 4.14.5 Conformal coating
• 5. Module interface requirements
• • 5.1 Mechanical configuration
  • 5.2 Module height
  • 5.3 Module span
  • 5.4 Module pitch
  • 5.5 Module profile
  • 5.6 Module frame
  • 5.7 Guide rib requirements
  • • 5.7.1 Guide rib structure
    • 5.7.2 Guide rib function
    • 5.7.3 Guide rib thickness
  • 5.8 Module header
  • 5.9 Connector
  • 5.10 Module keying
  • • 5.10.1 Keying pin orientation
    • 5.10.2 Keying pin location
    • 5.10.3 Keying pin styles
  • 5.11 Module retainers
  • 5.12 Module insertion/extraction
  • 5.13 Lateral displacement
  • 5.14 Durability
  • • 5.14.1 Displacement durability (floating modules)
    • 5.14.2 Displacement durability (non-floating modules)
• 6. Engineering notes
• • 6.1 Backplane connectors
  • 6.2 Chassis dimensions
  • 6.3 Weight
  • 6.4 Thermal considerations
  • • 6.4.1 Thermal interface temperature
    • 6.4.2 Recommended module power dissipation
    • 6.4.3 Thermal analysis
    • 6.4.4 Component layout
    • 6.4.5 Component mounting
  • 6.5 Structural testing
  • • 6.5.1 Module retaining fixture
    • 6.5.2 Fixture attributes
    • 6.5.3 Fixture verification
  • 6.6 Frame recommendations
  • • 6.6.1 Frame thickness
• Annex A Bibliography

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