IEEE Std 1101.4-1993 IEEE Standard for Military Module, Format E Form Factor -Description

Abstract: The mechanical design requirements for a military module, format E form factor are established. The specifications of dimensions and tolerances are intended to ensure the mechanical intermateability of military modules within associated subracks. Mechanical characteristics for military applications are also included.

Keywords: backplane, module, module interface plane, printed wiring board (PWB), 396-pin connector, 250-pin connector

Content

• 1. Overview
• • 1.1 Scope
  • 1.2 Purpose
  • 1.3 Environmental requirements
  • 1.4 Terminology
• 2. References
• 3. Definitions
• 4. Module requirements
• • 4.1 Module description
  • 4.2 Module construction
  • 4.3 Clearances
  • 4.4 Module identification
  • 4.5 Thermal requirements
  • • 4.5.1 Conduction cooling
    • 4.5.2 Direct air-impingement cooling
  • 4.6 Reliability
  • 4.7 Module warp
  • 4.8 Mechanical bonding
  • 4.9 Personnel safety
  • 4.10 Test points
  • • 4.10.1 Acceptance testing
  • 4.11 Module covers
  • 4.12 EMI considerations
  • 4.13 PWB characteristics
  • 4.14 Materials
  • • 4.14.1 Toxic materials
    • 4.14.2 Flammable material
    • 4.14.3 Material affected by fungus
    • 4.14.4 Adhesive-backed labels
    • 4.14.5 Hazardous components and materials
  • 4.15 Finishes and protective treatments
  • • 4.15.1 Module guide rib surface finish for a conduction-cooled module
    • 4.15.2 Copper and copper composite frame plating
    • 4.15.3 Aluminum and aluminum composite frame plating
    • 4.15.4 Connector body plating
    • 4.15.5 Conformal coating
• 5. Module interface requirements
• • 5.1 Mechanical configuration
  • 5.2 Module height
  • 5.3 Module span
  • 5.4 Module pitch
  • 5.5 Module profile
  • 5.6 Module frame
  • 5.7 Guide rib requirements
  • • 5.7.1 Guide rib structure
    • 5.7.2 Guide rib function
    • 5.7.3 Guide rib thickness
  • 5.8 Module header structure
  • 5.9 Connector
  • 5.10 Module keying
  • • 5.10.1 Keying pin styles
    • 5.10.2 Keying pin locations
    • 5.10.3 Keying pin orientation
  • 5.11 Lateral displacement
  • 5.12 Durability
  • • 5.12.1 Lateral displacement durability (floating modules)
    • 5.12.2 Lateral displacement durability (nonfloating modules)
  • 5.13 Module retainers
  • 5.14 Insertion levers
• 6. Engineering notes
• • 6.1 Backplane connectors
  • 6.2 Chassis dimensions
  • 6.3 Component layout
  • 6.4 Weight
  • 6.5 Thermal considerations
  • • 6.5.1 Thermal analysis
  • 6.6 Structural testing
  • • 6.6.1 Module retaining fixture
    • 6.6.2 Fixture attributes
    • 6.6.3 System level testing employing module retainers
    • 6.6.4 Fixture verification
  • 6.7 Frame recommendations
  • • 6.7.1 Frame thickness
    • 6.7.2 Frame construction

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