IEEE Std 1101.3-1993 IEEE Mechanical Standard for Conduction-Cooled and Air-Cooled 10 SU Modules -Description

Abstract: The mechanical design requirements for conduction-cooled and air-cooled modules of the 10 SU by 6.375 in (161.9 mm) format are established. The specification of dimensions and tolerances is intended to ensure the mechanical intermateability of modules within associated subracks. The basic dimensions, frames, PWBs, materials, assembly, and chassis interface of singlesided and double-sided modules are covered.

Keywords: conduction, convection, direct air impingement, heatsink, printed wiring board (PWB)

Content

• 1. Overview
• • 1.1 Scope
  • 1.2 Purpose
  • 1.3 Environmental performance level
  • 1.4 Terminology
• 2. References
• 3. Definitions
• 4. Requirements
• • 4.1 General requirements
  • 4.2 Detailed requirements
  • • 4.2.1 Module construction (CC)
    • 4.2.2 Module heatsink (CC)
    • 4.2.3 Module retainers (CC)
    • 4.2.4 Module levers (CC)
    • 4.2.5 Module header (CC)
    • 4.2.6 Module construction (AC)
    • 4.2.7 Module size and design features (AC)
    • 4.2.8 Front panel (AC)
    • 4.2.9 Injector/ejector mechanism (AC)
    • 4.2.10 Warpage (AC)
  • 4.3 Module connector requirements
  • • 4.3.1 Connector interface dimensions
    • 4.3.2 Connector contacts
  • 4.4 Module keying requirements
  • • 4.4.1 Keying pin orientation
    • 4.4.2 Keying pin locations
    • 4.4.3 Keying pin styles
  • 4.5 Printed-wiring and printed-wiring assemblies requirements
  • 4.6 Quality requirements
  • • 4.6.1 Materials
    • 4.6.2 Finishes and protective treatments
    • 4.6.3 Conformal coating
    • 4.6.4 Adhesive-backed labels
    • 4.6.5 Solder joints
  • 4.7 Environmental requirements
  • • 4.7.1 Durability (CC)
  • 4.8 Thermal requirements
  • • 4.8.1 Conduction-cooled modules
    • 4.8.2 Air-cooled modules (direct-air-impingement)
  • 4.9 Personnel safety requirements
  • • 4.9.1 High voltage
    • 4.9.2 Use of toxic materials
  • 4.10 Reliability requirements
  • 4.11 Module identification requirements
  • • 4.11.1 Module marking
    • 4.11.2 Module key code
• 5. Engineering suggestions
• • 5.1 Chassis interface (CC)
  • 5.2 Chassis interface (AC)
  • 5.3 Surface treatment
  • 5.4 Aluminum frame plating
  • 5.5 Thermal bonding
  • 5.6 Typical power dissipation
  • 5.7 Plated through-hole assembly guidelines
  • 5.8 Construction
  • 5.9 Components layout
  • 5.10 Chassis web surface finish
  • 5.11 Circuitry
  • 5.12 Backplane connector
  • 5.13 Shock and vibration fixture
  • • 5.13.1 Fixture attributes
    • 5.13.2 Fixture verification

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