IEEE Std 1101.10-1996 IEEE Standard for Additional Mechanical Specifications for Microcomputers Using the IEEE Std 1101.1-1991 Equipment Practice -Description

Abstract: A generic standard that may be applied in all fields of electronics where equipment and installations are required to conform to the 482.6 mm (19 in) equipment practice based on IEEE 1101.1-1991, IEC 297-3 (1984), and IEC 297-4 (1995). Dimensions are provided that will ensure mechanical interchangeability of subracks and plug-in units.

Keywords: dimensions, mechanical interchangeability, plug-in units, subracks

Content

• 1. Overview
• • 1.1 Scope
  • • 1.1.1 Dimensions of electromagnetic compatibility (EMC) subracks and associated EMC plug-in units
    • 1.1.2 Dimensions for plug-in unit injector and extractor handles
    • 1.1.3 Dimensions for plug-in unit keying
    • 1.1.4 Dimensions for electrostatic discharge (ESD) protection
    • 1.1.5 Alignment pin
    • 1.1.6 Protective solder side PB covers
    • 1.1.7 Dimensions for printed boards and backplanes using IEC 603-2 (1995)Type C 3-row and expanded 5-row connectors
    • 1.1.8 Dimensions for Printed Boards and Backplanes using center mounted connectors
  • 1.2 Purpose
• 2. References
• 3. Terminology
• • 3.1 Abbreviations
  • 3.2 Special word usage
• 4. General arrangement
• 5. EMC
• • 5.1 EMC subrack
  • 5.2 EMC filler panels
  • 5.3 EMC plug-in unit front panels
  • 5.4 EMC front panel/PB relationship
• 6. Keying and alignment pin
• • 6.1 General arrangement with keying and alignment
  • 6.2 Keying and alignment pin—dimensional relationship
  • 6.3 Keying dimensions—receptacles
  • 6.4 Key dimensions
  • 6.5 Programming of keys
  • 6.6 Alignment pin test dimensions
• 7. Protective solder side cover
• 8. Plug-in unit injector/ejector handles
• • 8.1 Subrack dimensions
  • 8.2 Injector and extractor handle detail
  • 8.3 Plug-in unit injector/ejector handle front panel component space
• 9. ESD protection
• • 9.1 Electrostatic discharge design requirements
  • • 9.1.1 Maintaining ESD contact during connector engagement
    • 9.1.2 Breaking ESD contact before connector engagement
    • 9.1.3 Subrack ESD contact position
• 10. Plug-in unit printed boards and backplanes using IEC 603-2 Type C, 3-row and expanded 5-row connectors
• • 10.1 Printed board dimensions
  • 10.2 Backplane dimensions
• 11. Plug-in unit boards and subrack backplanes using center connectors compatible to IEC 603-2 Type C, 3-row and expanded 5-row connector
• • 11.1 Printed board dimensions
  • 11.2 Backplane dimensions

links: [Standard Status] - [Purchase] - [PDF^*] - [Bus Architecture Collection - Description]

available for Standards Online Bus Architecture Collection subscribers only