IEEE Std 1101.1-1998 IEEE Standard for Mechanical Core Specifications for Microcomputers Using IEC 60603-2 Connectors -Description

Abstract: The basic dimensions of a range of modular subracks conforming to 60297-3 (1984-01) and 60297-4 (1995-03) for mounting in equipment according to 60297-1 (1986-09) and 310-D-1992, together with the basic dimensions of a compatible range of plug-in units, printed boards, and backplanes, are covered. The dimensions and tolerances necessary to ensure mechanical function compatibility are provided. This standard offers total system integration guidelines with attendant advantages, such as reduction in design and development time, manufacturing cost savings, and distinct marketing advantages.

Keywords: compatibility, mechanical interchangeability, plug-in units, subracks

Content

• 1. Scope
• • 1.1 Basic dimensions of subracks
  • 1.2 Dimensions of plug-in units
  • 1.3 Environmental requirements of subracks
• 2. Purpose
• 3. References
• 4. General arrangement
• 5. Euroboard matrix
• 6. Euroboard sizes
• • 6.1 Euroboard height
  • 6.2 Euroboard depth
  • 6.3 Euroboard thickness
  • 6.4 Conductive elements and guide rails
• 7. Position of plug-in unit mounted connectors, board-type and box-type
• 8. Plug-in unit description
• 9. Plug-in unit dimensions
• • 9.1 Board-type plug-in units
  • 9.2 Box-type, box/board-type plug-in units
• 10. Backplane design and mounting positions
• • 10.1 Rigidity
  • 10.2 Dimensions
• 11. Subracks
• 12. Environmental specifications
• • 12.1 Introduction
  • 12.2 Climatic tests
  • • 12.2.1 Steady cold
    • 12.2.2 Steady dry heat
    • 12.2.3 Cyclic damp heat
    • 12.2.4 Salt mist
  • 12.3 Mechanical load
  • • 12.3.1 Load per 1 HP (84 HP available)
    • 12.3.2 Mounting configuration and axis
    • 12.3.3 Load distribution
  • 12.4 Vibration
  • 12.5 Shock
  • 12.6 Safety tests
  • • 12.6.1 Earth resistance
    • 12.6.2 Flammability of plastic materials
    • 12.6.3 Transport recommendation
    • 12.6.4 Mass >30 kg
    • 12.6.5 Mass <30 kg
    • 12.6.6 Electromagnetic interference/radio-frequency interference (EMI/RFI)
    • 12.6.7 Cooling
• Annex A Bibliography

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