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Standards Development Working Group

Probe - Subcommittee on Probe Standards

SCOPS is currently in the process of developing a standard for test methods and transfer (artifact) standards that will be used to characterize individual probes having one signal conductor and one ground conductor or two signal conductors, and having an input impedance greater than the impedance of the circuit under test. The scope of this standard, as stated in the Project Authorization Request is: “This standard provides test method(s) and describes transfer (artifact) standards for characterizing electrical circuit probes and probes systems. The systems may include waveform acquisition hardware and software and signal/waveform analysis software. The probe will include the mechanism by which the circuit is contacted. This method and standard will be applicable to all individual probes having one signal conductor and one ground conductor or two signal conductors, and having an input impedance greater than the impedance of the circuit under test.” The present work is only considering voltage probes, including high-voltage probes. Current and field probes are not being considered at this time by may be the topic of future standards. This work also includes the analog portion of logic probes. More information on the purpose and need for this work is described in the Project Authorization Request (PAR) form (see link below) for this project, P-1696 - Standard for Terminology and Test Methods for Circuit Probes. Upon completion of this activity and approval by the IEEE, a standard will be published. The present activity includes identifying relevant performance metrics and developing associated test methods for probing systems. Details of our work done thus far can be found in the “private area,” which requires membership to enter (see link below). SCOPS is actively seeking new members. Anyone who wishes to contribute to the development of the standard, such as by contributing to the identification of performance metrics, drafting descriptions of test methods, suggesting designs for artifact standards, reviewing text and suggesting improvements, providing doughnuts at the meetings, should contact the chairman at the link below.

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