IEEE
BEGINS STANDARD ON USE OF CHEMICAL VAPOR DEPOSITION IN NANOSCALE
DEVICES
Contact:
Harvey
Mecham, Chair of the Nanotechnology
CVD Working Group +1 801-863-8629; mechamha@uvsc.edu
or
Karen
McCabe, IEEE Senior Marketing Manager
+1 732-562-3824, k.mccabe@ieee.org
PISCATAWAY,
N.J., USA, 9 December 2004 Chemical vapor deposition (CVD)
has emerged as an essential tool for building the interfaces that
link nanoscale elements with other electronic components in complex
devices. In seeking to help nano-related CVD interfaces migrate
from the laboratory to the production line, the IEEE has begun
work on a standard to address the use of CVD methods with nanoscale
structures.
The standard,
IEEE P1670™, "Chemical Vapor Deposition (CVD) Techniques
for Nanotechnologies," will establish uniform recommendations
for the measurements and analyses needed in CVD nanoscale processing.
Theanticipated result will be that data generated in research
and destined for manufacturing activities in electronic, thermal
and power components are consistent and reproducible. The standard
is targeted for completion in early 2006.
"In crafting
this core standard, we will look at a spectrum of available CVD
processes to see which best apply to nanotechnology," says
Harvey Mecham, Chair of the Nanotechnology CVD Working Group.
"I expect the measurement methods in the standard will include
Fourier transform infrared spectrometry for monitoring bonding
characteristics, as well as mass spectrometry and perhaps advanced
microscopic technologies. Our overriding goal is to help jump
start the transition for nanoscale CVD processes
from R&D to manufacturing."
CVD lays down
matter in extremely thin films that can form transitions between
nanoscale and microscale components in complex optical and electronic
systems having carbon- and silicon-based materials. The film structures
it creates can allow nanoscale elements to communicate with other
elements in a system. CVD involves chemical reactions that transform
gaseous molecules into solid films on substrates. It is widely
used to produce semiconductor and microelectronic devices and
protective coatings. In a typical CVD process, gas molecules are
excited in a reaction chamber. Then, through a complex series
of reactions, these molecules in the vapor state interact with
the substrate surface to produce a thin deposited film. This film
may subsequently be patterned.
Those in the
public or private industrial and R&D communities who want
to help develop the CVD nanoscale standard are invited to join
the IEEE 1670 Working Group. For information on the Group's upcoming
meetings, e-mail
Harvey Mecham at: mechamha@uvsc.edu.
IEEE P1670
is sponsored by the IEEE Nanotechnology Council Standards Committee.
About the
IEEE Standards Association
The IEEE Standards Association, a globally recognized standards-setting
body, develops consensus standards through an open process that
brings diverse parts of an industry together. These standards
set specifications and procedures based on current scientific
consensus. The IEEE-SA has a portfolio of more than 870 completed
standards and more than 400 standards in development. For information
on IEEE-SA see http://standards.ieee.org/.
About the
IEEE
The IEEE has more than 360,000 members in approximately 175 countries.
Through its members, the organization is a leading authority on
areas ranging from aerospace, computers and telecommunications
to biomedicine, electric power and consumer electronics. The IEEE
produces nearly 30 percent of the world's literature in the electrical
and electronics engineering, computing and control technology
fields. This nonprofit organization also sponsors or cosponsors
more than 300 technical conferences each year. Additional information
about the IEEE can be found at http://www.ieee.org.
IEEE
P1670 is a trademark of the IEEE. All other names or product names
are the trademarks, service marks or registered trademarks of
their respective holders.
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